Method for mounting an electronic module in a card body
US5951810A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 24, 1996 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Jan 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48228
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method is described for mounting an electronic module in an opening in a card body using pressure and heat. To avoid the thermal load on the electronic module and the card body during the relatively short heating-up phase in a fixed-cycle production process, the method is divided into several method steps, whereby either the heating of the electronic module and the card body and optionally a thermally-activable adhesive takes place in several method steps, or a thermally activable adhesive is heated selectively in a first method step and the mounting of the electronic module takes place under pressure or under pressure and heat in a second method step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.