Method for making bump disks
US5951880A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | May 26, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wet etching method for making calibration bump disks for use in providing quality control of production run magnetic hard disks is disclosed. It includes the steps of: (a) coating a layer of bump material on a substrate; (b) coating a photoresist layer on the layer of bump material; (c) exposing the photoresist layer to a light source under a photomask; (d) developing the photoresist layer using a developer solution to form an undeveloped photoresist layer; (e) etching the substrate containing the layer of bump material and the undeveloped photoresist layer to remove portions of the layer of bump material not covered by the undeveloped photoresist layer; and (f) stripping the undeveloped photoresist layer to leave at least a bump on the substrate which was originally covered by the undeveloped photoresist layer. The wet etching method eliminates many of the problems observed from the conventional metal mask method, including the elimination of the convex-shaped bump surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.