Integrated circuit pad structure with high temperature heating element and method therefor
US5951893A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Jun 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heater circuits (13) are placed in close proximity or integrated with connection points (12) of an integrated circuit. A connection point is an area where a wire bond or conductive bump is coupled for providing electrical interconnection external to an integrated circuit. Heater circuits (13) are polysilicon strips that form resistive heat elements. A DC voltage or a pulsed voltage is applied to the heater circuits (13) to generate a local heat at the connection points that can reach temperatures exceed 1000 degrees centigrade. The heat is localized to an area near the connection point to prevent damage to temperature sensitive material. The heater circuits (13) raise the temperature of the connection points (12) to increase bond strength of a wire bond or to reflow a conductive bump to adhere to a connection point of another substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.