Polyacetal resin composition exhibiting high retentivity of mechanical strengths
US5952410A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1998 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Jan 9, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a polyacetal resin composition comprising 100 parts by weight of polyacetal resin having a melting temperature of from 150 to 161.degree. C.; 0.01 to 5.0 parts by weight of at least one bisamide compound of formula (1) ##STR1## and 0.0001 to 5.0 parts by weight of at least monoamide compound of formula (2) ##STR2## in which formulae (1) and (2) each of R.sup.1, R.sup.3 and R.sup.6 independently is an alkyl or an alkenyl, and R.sup.2 and R.sup.7 independently is an alkylene, an alkenylene, or --R.sup.4 --Ph--R.sup.5 -- (each of R.sup.4 and R.sup.5 independently is a single bond or a methylene, and Ph is a phenylene). The resin composition of the present invention has excellent mechanical strength retentivity during cooling-heating cycles. For example, not only occurrence of whitening, crazing or cracking but also lowering in impact resistance can be suppressed even after the resin composition experiences repeated cooling-heating cycles. Thus, the resin composition of the present invention can be advantageously used in various applications where repeated heating-cooling cycles are necessarily experienced. Also, disclosed is an insert molded article comprising the above-m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.