Multi-layered printed-coil substrate, printed-coil substrates and printed-coil components
US5952909A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1996 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Sep 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process of producing a multi-layered printed-coil substrate as a planar magnetic component for use as a transformer or a choke in a switched mode power supply circuit, etc. in which several types of printed-coil substrates having individually different coil patterns are prepared, some of them are selected depending upon the desired characteristics of planar magnetic component, and the selected substrates are layered to obtain a multi-layered printed-coil substrate. A printed-coil component, wherein pin terminals erected on insulating bases are inserted through through-holes formed in the printed-coil substrate having patterned coils in a single or several layers and pin terminals are soldered to the through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.