Reworkable circuit board assembly including a reworkable flip chip
US5953210A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 8, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Jul 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.