Spherical shaped semiconductor integrated circuit
US5955776A · kind A · utility
81Cited by
38References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 16, 1997 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/947
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A spherical shaped semiconductor integrated circuit ("ball") and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.