Method and structure for a surface mountable rigid-flex printed circuit board
US5956234A · kind A · utility
36Cited by
15References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and structure for a surface mountable rigid-flex printed circuit board is disclosed. A rigid-flex circuit board is mounted onto a printed circuit board using standard surface mount technology such as ball grid array, pin grid array or solder screen print. The use of rigid-flex board allows tested, burned in components to be used while still allowing a small multiple chip module footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.