Tungsten-copper composite powder
US5956560A · kind A · utility
7Cited by
9References
9Claims
0Family size
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Key dates
| Filing date | Jan 15, 1997 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Jan 15, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2993
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.