Hybrid substrate for cooling an electronic component
US5958572A · kind A · utility
42Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249999
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The substrate (10) has a first side (12) and a second side (14) and includes an insert material (16) having a first thermal conductivity (24) in a first direction (25) and having a second thermal conductivity (26) in a second direction (27). A plurality of vias (30) are formed in the second direction through the insert material and an encapsulant material (18) surrounds the insert material. When an electronic component (22) is disposed on the first side, heat (25) from the electronic component is conducted in the first direction by the insert material and is conducted in the second direction through the plurality of vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.