Thermosensitive etch resist for forming a mask
US5958647A · kind A · utility
5Cited by
14References
22Claims
0Family size
Inventor
Key dates
| Filing date | May 20, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | May 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermosensitive resist used in the manufacturing of printed circuit boards comprising a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorber and modifiers such as additional polymers. In the unheated form the resist can be easily washed away with water-based mild solutions or pure water. When selectively heated by an IR laser a non-soluble, etch resistant composition is formed protecting the copper clad printed circuit board from the etchants used in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.