Low cost protective coating and method for a die-on-board electronic assembly
US5959247A · kind A · utility
6Cited by
13References
10Claims
0Family size
Inventors
Key dates
| Filing date | Jul 22, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Jul 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit assembly includes a printed circuit board having a plurality of conductors formed thereon. An integrated circuit die is mounted directly on and bonded to the circuit board. A plurality of microleads extend between the integrated circuit die and conductors and are ultrasonically bonded to the die and conductors. A protective coating deposited on the circuit board encapsulates the circuit die and microleads. Methods for depositing the coating include flow and cure, immersion and plasma spray techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.