Apparatus for cooling multiple printed circuit board mounted electrical components
US5959840A · kind A · utility
20Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Jun 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.