Modular surface mount circuit device and a manufacturing method thereof
US5959846A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Dec 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.