Process for forming a semiconductor device
US5961373A · kind A · utility
46Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Jun 16, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for conditioning a polishing pad has been developed that incorporates in-situ conditioning where the conditioning is performed while the substrate (27, 40) is on the polishing pad (22) but terminates before the polishing of the substrate (27, 40) is completed. In one embodiment, ex-situ conditioning of the polishing pad (22) is used on the polishing pad between substrates (27, 40). The process has benefits of both in-situ and ex-situ conditioning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.