Ultrasound signal processing electronics with active cooling
US5961465A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1998 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Feb 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasound transducer structure in accord with the invention includes: an ultrasound transducer operable to generate and receive ultrasonic energy, a communication cable, integrated circuits for processing signals received from said ultrasound transducer and flexible circuits for connecting the communication cable to the integrated circuit, and for further connecting the integrated circuits to the ultrasound transducer. A housing contains the ultrasound transducer, the integrated circuits and the flexible circuits. A heat transfer structure is positioned within the housing and is in contact with the integrated circuit. A heat conductor resides in contact with the heat transfer structure and conducts heat generated by the integrated circuits to a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.