Method for selecting a substrate intended for use in a cutting operation
US5961766A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1998 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention relates to a method for selecting a substrate intended for use in a cutting operation. The method is particularly suitable for selecting facestock materials intended for use in making pressure-sensitive adhesive (PSA) constructions such as PSA labels. The method includes the following steps (A)-(D). Step (A) involves cutting the substrate during a first cutting step to form at least two shapes in the substrate. The shapes are positioned in spaced relationship to each other. A matrix is formed during this cutting step. The matrix is the waste substrate material around the shapes. Step (B) involves cutting the substrate with a second cutting step to form a test sample. The test sample is comprised of part of one shape, part of the next adjacent shape, and the matrix around the shape parts. Step (C) involves separating the matrix from the shape parts while measuring the force required to separate the matrix from the shape parts and measuring the displacement of the separating force. Step (D) involves determining the friction energy required to separate the matrix from the shape parts. The selection of the substrate is dependent on the friction energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.