Patent · US Expired

Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer

US5962139A · kind A · utility

5Cited by

2References

25Claims

0Family size

Assignees

HITACHI CHEMICAL COMPANY, LTD. · JP
Wacker Chemie AG · DE

Inventors

Shinsuke Hagiwara · Chikusei, JP
Hiroyuki Saitoh · Yokohama, JP
Hiroki Sashima · Chikusei, JP
Peter Huber · Neubiberg, DE
Bernward Deubzer · Burghausen, DE
Michael Geck · Burghausen, DE

Key dates

Filing date	Jan 29, 1998
Grant date	Oct 5, 1999
Priority date	—
Expiry date	Jan 29, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31522
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.