Molding resin, composition containing the same, and process for producing them
US5962599A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Sep 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/943
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molding resin having improved processability is disclosed, comprising a copolymer of ethylene and an .alpha.-olefin having 3 to 12 carbon atoms and having the following properties PA1 (a) a weight average molecular weight Mw to number average molecular weight Mn ratio (Mw/Mn) of 3 or less as determined by gel permeation chromatography; PA1 (b) a density of 0.850 to 0.980 g/cm.sup.3 ; PA1 (c) a melt flow rate of 0.5 to 5 g/10 min as measured at 190.degree. C. under a load of 2,160 g according to JIS K7210, Condition 4; PA1 (d) a slope S of storage modulus G' in a frequency region of from the frequency (f.sub.c) at which storage modulus G' and loss modulus G" agree with each other to f.sub.c /10, which is obtained from the frequency dependence of dynamic viscoelasticity, i.e., .DELTA.log G'/.DELTA.log f, of more than 0.70 and less than 0.90; and PA1 (e) an activation energy of flow .DELTA.H of 35 kJ/mol or less as obtained at 160 to 220.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.