Package for a magnetic field sensing device
US5963028A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Aug 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.