Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers
US5963289A · kind A · utility
56Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Oct 27, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133351
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing liquid crystal on silicon devices uses asymmetric placement of scribes on silicon and glass substrate layers to maximize the yield of processed active matrix silicon wafers. Asymmetrical scribing minimizes a dimension from a gasket seal between the substrates to a lower bond pad edge. An opposite glass overhang provides an interconnect redundancy for an ITO plate or a repair site for electrical contact to the ITO plate. Methods of device separation employing partial sawing are also employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.