Tungsten skeleton structure fabrication method employed in application of copper infiltration and tungsten-copper composite material fabrication method thereof
US5963773A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1998 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Jun 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A tungsten skeleton structure fabrication method employed in an application of a copper infiltration and tungsten-copper composite fabrication method includes the steps of forming a source powder by coating the tungsten powder surface having a purity of 99.9 weight percent and 2.about.5 .mu.m in size, with nickel by less than 0.06 weight percent (600 ppm), forming an injection molded admixture by admixing a source powder and a polymer binder, carrying out a powder injection molded with regard to the admixture, and obtaining a tungsten skeleton structure by removing the polymer binder from the resultant injection molded body. The method prevents the molded body from being unevenly shrunken during a liquid phase sintering for thereby decreasing its production cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.