Apparatus for polishing planar substrates through rotating plates
US5964651A · kind A · utility
31Cited by
8References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Oct 28, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/8404
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.