Microetching composition for copper or copper alloy
US5965036A · kind A · utility
44Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.