Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
US5965193A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Molten aluminum and a ceramic substrate are held in direct contact with each other and thereafter cooled to have the aluminum joined directly to the ceramic substrate. This method is capable of consistent and easy production of aluminum-ceramics composite substrates having satisfactory joint strength, thermal conductivity and heat resistance characteristics. A ceramic member is fed successively into and through molten metal to directly bond the metal on the ceramic to produce a metal-bonded-ceramic (MBC) material at a low cost. An electronic circuit substrate made of an aluminum ceramic composite material wherein an electronic circuit is formed on an aluminum surface of the aluminum-ceramic composite material. The aluminum-ceramic composite material is made by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.