Use of silicone-modified epoxy resins as sealing compound

US5965637A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Werner Pfander · Fellbach, DE
• Irene Jennrich · Winnenden, DE
• Richard Spitz · Reutlingen, DE
• Uwe Koehler · Wissen, DE
• Siegfried Schuler · Reutlingen, DE

Key dates

• Filing date: Jun 10, 1998
• Grant date: Oct 12, 1999
• Expiry date: Jun 10, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.