Patent · US Expired

Thermally stable copper-containing polyamide molding compounds

US5965652A · kind A · utility

6Cited by

11References

7Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Aziz El Sayed · Leverkusen, DE
Edgar Ostlinning · Goldkronach, DE
Alban Hennen · Leverkusen, DE
Georg Heger · Krefeld, DE
Werner Nielinger · Krefeld, DE
Karsten-Josef Idel · Krefeld, DE
Klaus Sommer · Heidelberg, DE
Raymond Audenaert · Hamme, BE

Key dates

Filing date	Feb 10, 1994
Grant date	Oct 12, 1999
Priority date	—
Expiry date	Feb 10, 2014

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K5/0091
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to thermally stable and UV-stable polyamide molding compounds containing colloidal copper formed in situ and to a process for their production.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.