Low impedance connection for an EMI containment shield including metal plating bonded to the shielded equipment through openings in a conductive ribbon
US5965842A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Jan 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/32
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an EMI shield having a low impedance connection to ground for use in electronic equipment, particularly computer systems. More particularly, an EMI shield for electronic equipment is disclosed which includes a conductive ribbon, such as a copper ribbon with a polyimide backing, the conductive ribbon having openings and coupled to a ground plane. The conductive ribbon contacts a surface of a section of the electronic equipment to be shielded. A hold down frame of a non-conductive material holds the conductive ribbon in a fixed position on the section of the electronic equipment to be shielded. A metal plating, such as a combination of copper and nickel, bonds to the section of the electronic equipment to be shielded and to the conductive ribbon. The metal plating contains the EMI. The plating also bonds to the section of the electronic equipment through the openings of the conductive ribbon wherein the metal plating and the conductive ribbon form a low impedance connection to ground. In one embodiment the openings in the conductive ribbon are slots and in another the openings are circular holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.