Thick film resistor and the manufacturing method thereof
US5966067A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/142
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.