Method for manufacturing thermal-type infrared sensor
US5966590A · kind A · utility
3Cited by
2References
2Claims
0Family size
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Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a method of manufacturing a thermal-type infrared sensor including a thermosensitive part, a bolometer material is formed as the thermosensitive part and is subjected to post-processing to control a temperature coefficient of resistance in the bolometer material. The bolometer material may be formed by titanium or vanadium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.