Semiconductor thermal conditioning apparatus and method
US5966940A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate for sensing the temperature of the surface plate. The thermoelectric device has first and second sides with the first side disposed against the surface plate. The closed loop heat exchanger is coupled to the second side of the thermoelectric device. The closed loop heat exchanger includes a chamber or cavity having an inlet and an outlet with the chamber disposed adjacent the second side of the thermoelectric device. The closed loop heat exchanger further includes conduit connected to the inlet and outlet of the chamber and a heat transfer unit connected to the conduit opposite the chamber. Heat transfer fluid is contained within the closed loop heat exchanger and a pump is provided for pumping the heat transfer fluid through the closed loop heat exchanger wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer flui…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.