Thermal process for applying hydrophilic layers to hydrophobic substrates for offset printing plates
US5967047A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C4/11
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a process for preparing printing plates which are used in offset printing. The process produces a plate which comprises a substrate film in which a thin durable hydrophilic layer has been applied thereto. In the process, the substrate film is first microroughened by pressure blasting so that the surface roughness, R.sub.A, is in the range 0.3 to 1.5 .mu.m. Subsequently, a durable, firmly adhering hydrophilic layer is applied to substrate by plasma-spraying an oxide powder with a particle size of 1 to 40 .mu.m onto the substrate. This process produces a plate whose surface is not greasy or grainy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.