Electroplated Ag-Ni-C electrical contacts
US5967860A · kind A · utility
11Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | May 23, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Nesting electrical connectors comprising a substrate and a silver-nickel-carbon electrodeposit atop the substrate. The electrodeposit is at least about 0.5 micrometers thick, and comprises about 10 to about 25 atomic percent nickel which is dispersed as a discontinuous phase throughout a continuous phase of the silver and has a Scherrer grain size less than about 5 nanometers. The carbon comprises about 5 to about 15 atomic percent of the deposit and has a non-crystalline graphite structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.