Polishing composition including water soluble polishing agent
US5968238A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1998 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Feb 18, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An improved polishing composition is provided that includes an emulsion of a oil-based components and water-based components and a water soluble polishing agent. The polishing composition of the present invention is rubbed on a painted surface, hosed off with water and wiped or towel dried. Because of the use of a water soluble polishing agent in the polishing composition, all or substantially all of the polishing agent is washed away with the water. This eliminates the need for a two-step polishing process wherein a polishing composition is applied to a surface and allowed to dry in a first step and the surface is buffed with a dry cloth in a second step. One preferred embodiment of the present invention includes silicones, water, a nonionic or anionic surfactant and a water soluble polishing agent. Optionally, the polishing composition may include a solvent, mineral oil, wax, and a preservative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.