Device for sputter deposition of thin layers on flat substrates
US5968328A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Dec 11, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/568
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an apparatus for the sputter deposition of thin electrically insulating layers on substrates (33, 33', . . . ) there is provided in an evacuable chamber which is connected to a treatment gas source, a first pair of tubular magnetron cathodes (5, 5' or 31) and at least one additional pair of magnetron cathodes (6, 6' or 25, 26 or 30, 32), a medium frequency generator (10) connected in series with a transformer (9), where the two secondary winding outputs (11, 12) of said transformer are each connected with the cathodes of a second pair (6, 6' or 25, 26 or 30, 32) and where direct current can be fed into the supply lines for the first cathode pair (31) via a center tap (15) of the transformer (9) and a network (17 or 13, 14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.