Epoxy-containing die-attach compositions
US5969036A · kind A · utility
41Cited by
11References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Jun 20, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.