Patent · US Expired

Transparent molding materials resistant to stress cracking and having improved toughness/rigidity ratio

US5969042A · kind A · utility

8Cited by

9References

7Claims

0Family size

Assignee

BASF SE

Inventors

Kristin Tiefensee · Bad Dürkheim, DE
Norbert Güntherberg · Speyer, DE

Key dates

Filing date	Jan 13, 1998
Grant date	Oct 19, 1999
Priority date	—
Expiry date	Jan 13, 2018

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/02
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding materials contain a mixture of PA1 (A) a methacrylate polymer, PA1 (B) a copolymer of vinylaromatic monomers and vinyl cyanide, PA1 (C) a graft copolymer comprising a core and a graft shell and PA1 (D) a further graft copolymer comprising a core and a graft shell, the average particle size (d.sub.50)-C of the graft copolymer (C) being from 25 to 60 nm and that of the graft copolymer (D) being from 90 to 300 nm and the ratio of the average particle size (d.sub.50)-C to (d.sub.50)-D being kept in the range from 2:1 to 5:1.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.