Method and apparatus for testing junction strength of electrode
US5969262A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0296
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe made of copper and supported by a movable arm via a load cell and a jig has a joining surface having good wettability with solder at the tip end thereof and has a covering portion having poor wettability with the solder around the circumferential periphery. The solder and flux are stuck to the joining surface and the solder is put into contact with a bump electrode to be tested on a substrate in this state. Then, the solder is melted by an induction heating coil and then cooled down and solidified to join the bump electrode to be tested to the probe. The bump electrode is broken by pulling up the probe in this state at a constant speed and at the same time the pulling force exerted on the probe is measured by the load cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.