Integrated circuit structure having an active microwave component and at least one passive component
US5969405A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 7, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Mar 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/00
Abstract
Integrated circuit structure having an active microwave component and at least one passive component. A high-resistance silicon substrate (11) comprises an active microwave component (16) and at least two metallization planes (12, 14), which are insulated from one another by an insulation layer (13). A passive component surrounded by a grounded line (122) in one of the metallization planes (12) is provided, which comprises a first metal structure (121), which is realized in the first metallization plane (12), and a second metal structure (141), which is realized in the other metallization plane (14). The passive component is designed, in particular, as a capacitor, coil or resonator which comprises a capacitor and a coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.