Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
US5969944A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1998 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Sep 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.