Microelectromechanical structure and process of making same
US5970315A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Oct 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/89
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a process for fabricating a microelectromechanical device from a substrate carrying at least one layer of a non-erodible material laid out to form at least a portion of the microelectromechanical device, at least one layer of an erodible material, and at least one sacrificial layer. The process includes the step of using the layer of non-erodible material as a mask and anistropically etching any of the layer of erodible material not occluded by the layer of non-erodible material. The process also includes the step of isotropically etching the sacrificial layer under at least a beam portion of the microelectromechanical device to free the beam portion of the microelectromechanical device from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.