Injection of encapsulating material on an optocomponent
US5970323A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1997 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | Jun 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold. The elastic force can also be obtained directly from a leadframe, to which the optocomponent is attached for electrical connection, or from a small elastic part, placed in the cavity in the mold, this part then remaining in the capsule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.