Stamp cassette for thermal stencil paper
US5970868A · kind A · utility
3Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | May 8, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41K1/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A stamp cassette includes a thermal stencil paper and a transport-assistant tape housed in a stamp cassette housing. The thermal stencil paper and the transport-assistant tape are wound together in two layers about a core in the stamp cassette housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.