Gasket for use in a container
US5971191A · kind A · utility
11Cited by
17References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 14, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Feb 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67376
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A container for packing semiconductor wafer is provided which has superior airtightness to prevent contamination of the wafers by air. A gasket groove is formed on the case of the container. A gasket is inserted within the gasket groove. The gasket contains protrusions that assist in providing an airtight seal. The case and a lid are securely fastened together by the engagement of four clips within respective clip recesses that are formed in the container and lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.