Microdevice valve structures to fluid control
US5971355A · kind A · utility
163Cited by
16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A valve array system including microelectromechanical valves embedded in a dielectric substrate is disclosed. These microelectromechanical valves can be batch fabricated using resin impregnated dielectric laminates having photolithographically formed circuitry for electrical connections. Movable components of valves, including electromagnetic or electrostatically actuated membranes, flaps, or beams, can be formed from laminate material using sacrifice layers and etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.