Indirect bonding method and adhesive for orthodontic treatment
US5971754A · kind A · utility
Inventors
Key dates
| Filing date | Jul 30, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Jul 30, 2018 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61C7/146
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of indirect bonding used in orthodontic treatment includes the steps of placing a first component of an adhesive on base structure of an orthodontic appliance and a second component of the adhesive on portions of a patient's tooth. The appliance is connected to a transfer tray, and the transfer tray is placed over the tooth such that the first component and the second component contact each other and react to provide a bond for securing the appliance to the tooth. The bond has sufficient strength within two minutes and preferably within 1.5 minutes of the time that the first component contacts the second component to enable removal of the tray from the tooth without significantly changing the position of the appliance on the tooth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.