Debris-free wafer marking method
US5972234A · kind A · utility
20Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Apr 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a method for marking an electronic substrate without the splatter or debris defect which can be carried out by first providing a tape, then creating a cavity or a mark through the tape by a high-intensity energy beam or any other suitable mechanical means such that the tape can be laminated to a top surface of the substrate and exposed to an etchant until a similar mark in the substrate is reproduced by the etching process. After the tape is removed, the mark is reproduced in the surface of the electronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.