Method for forming film by plasma polymerization and apparatus for forming film by plasma polymerization
US5972435A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Aug 24, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention manifests a highly excellent effect of allowing the plasma polymerization film to be formed stably for a long time while very rarely suffering occurrence of abnormal discharge during the formation of the plasma polymerization film and promoting the improvement of the yield of products because it adopts as the electrode for implementing plasma polymerization that of the electrodes which is located on the side confronting a surface on which the plasma polymerization film is formed, coats this electrode with a polymer material at a covering ratio in the range of 50-100%, and effects the formation of the plasma polymerization film on an elongate substrate under the operating pressure in the range of 10.sup.-3 -1 Torr. Further, the properties of the plasma polymerization film also become highly excellent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.