Method for producing semiconductor chips

US5972781A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• Siemens Microelectronics, Inc. · US

Inventors

• Walter Wegleiter · Nittendorf, DE
• Olaf Schoenfeld · Regensburg, DE
• Muk Wai Lui · Milpitas, US
• Ernst Nirschl · Wenzenbach, DE

Key dates

• Filing date: Sep 30, 1997
• Grant date: Oct 26, 1999
• Expiry date: Sep 30, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/78
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.