(Oxide or sulfide) powder epoxy (meth) acrylate w/glass and/or metal
US5973034A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/864
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There are provided a resin composition and hardened products thereof for use in resistors, phosphors, conductors, patterns and the like, which can be developed with water or a dilute alkaline aqueous solution, show good pattern accuracy, give small residual organic matter after baking and have excellent adhesiveness. The resin composition which comprises (A) an unsaturated group-containing resin which is an epoxy methacrylate resulting from the reaction of (a) an epoxy resin having at least two epoxy groups in its molecule with (b) a compound having one unsaturated double bond and one carboxyl group in one molecule and (c) a saturated monocarboxylic acid as an optional component, the reaction product epoxy (meth)acrylate being allowed to react with (d) a polybasic acid anhydride as occasion demands, (B) a diluent, (C) a photopolymerization initiator and (D) one or more substances selected from metal powders, metal oxides, metal sulfides or glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.